Purpose: ARINC Specification 650 defines the packaging detailsfor Integrated Modular Avionics (IMA). It is intended to take fulladvantage of technical advancements in electronics equipmentpackaging and provide improved mechanical, electrical andenvironmental interface techniques for the installation of avionicsequipment. These include advances in semiconductor technology whichmay result in significant space and weight savings to the aircraftwith further advantages from the development of standard modules.Airlines have expressed the desire for new packaging concepts whichtake full advantage of current technology. The packaging conceptsof ARINC Specification 650 are expected to simplify thedevelopment, acquisition, installation and maintenance of avionics,compared to earlier systems and equipment generations.
To reduce the cost of ownership, weight and volume of newhardware installed in airplanes, avionics system architectures havebeen developed and are described by ARINC Report 651, “DesignGuidance for Integrated Modular Avionics”. For these to be totallyeffective, new standards for hardware packaging have been developedin this Specification. This packaging Specification defines LineReplaceable Modules (LRM) that are installed in operationaltransport aircraft.
This Specification is intended to be the predominate standardused for future avionics hardware. It does not, however, supersedeARINC Specifications 404A and 600.
- Edition:
- 94
- Published:
- 07/01/1994
- Number of Pages:
- 119
- File Size:
- 1 file , 5.2 MB
Reviews
There are no reviews yet.