This report is focused on managing the maintenance and repair ofsoldered assemblies during the transition to lead-free technology.The terms lead-based and lead-free refer to alloys used in solderedassemblies.
This report provides guidance for:
•The transition to, and continued maintenance of, lead-freeelectronics including configuration control and identification ofequipment, assemblies, and sub-assemblies.
•The roles and responsibilities of participants in the airtransport industry.
•Using industry standards for developing a lead-free solderingprogram tailored to meet the specific requirements of the user.
•Developing programs, processes, and documentation for lead-freesolder maintenance and repair.
This report is not a stand-alone document—it is intended to beused with the referenced industry standards and should be acceptedthroughout the air transport industry.
The equipment design documentation defines the basic parts andsolder alloys used and is considered to be beyond the scope of thisdocument.
- Edition:
- 06
- Published:
- 03/15/2006
- Number of Pages:
- 19
- File Size:
- 1 file , 260 KB
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