Purpose
This test is performed for the purpose of determining whether connectorscan withstand the effects of the heating and/or environment to whichthey will be subjected during the soldering of their terminations bysolder dip, soldering iron, solder wave, or reflow solderingtechniques.The heat and/or environment of soldering may affect theelectrical characteristics of the connector and may cause damage to thematerials making up the connector.It may also result in loosening ofterminations, softening or distortion of insulation materials, openingof solder seals, weakening of mechanical joints, etc.
- Edition:
- A
- Published:
- 01/01/1991
- Number of Pages:
- 12
- File Size:
- 0 files
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