ECIA CB 5

This test procedure provides standard methods for the evaluationof semiconductor thermal dissipators.

Purpose:

The purpose of this Bulletin is to establish standard proceduresfor the evaluation, calibration, and presentation of test data forsemiconductor thermal dissipators. Since semiconductor and thermaldissipator temperature measurements are meaningless when testconditions are not uniform or controlled, this test procedure willdefine the methods for testing and presenting data on temperaturemeasurements of semiconductor junction, semiconductor case,chassis, thermal dissipator, and ambient under both natural andforced convection environments.

Nomenclature :

The commonly used and incorrect term “heat sink” refers inpractice to “heat” or “thermal” dissipators used to reduce theoperating case temperature of a semiconductor by transferring heatt o an ambient fluid.

Edition:

69

Published:

07/01/1969

Number of Pages:

17

File Size:

1 file , 710 KB