The ball grid array (BGA) burn-in sockets of assessed qualitycovered by this Detail Specification have:
— Maximum enclosure dimensions as shown in figure 2.
— A working voltage not exceeding 250 volts (rms).
— Current rating not exceeding 1 ampere per pin.
Object
The object of this Detail Specification is to provide allinformation required for the identification and quality assessmentof the burn-in socket for ball grid array devices described hereinby the EIA. The information, contained herein or by reference, iscomplete and sufficient for inspection purposes.
- Edition:
- 00
- Published:
- 06/01/2000
- Number of Pages:
- 31
- File Size:
- 0 files
Reviews
There are no reviews yet.