This standard establishes a test method for determining whetherconnectors can withstand theeffects of the heating and/or environment that they will be subjectedto during the soldering oftheir terminations by solder dip, soldering iron, solder wave, orreflow soldering techniques.
- Edition:
- B
- Published:
- 04/01/2005
- Number of Pages:
- 20
- File Size:
- 0 files
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