EIA/ECA-364-56
This standard establishes a test method for determining whetherconnectors can withstand the effects of the heating and/orenvironment that they will be subjected to during the soldering oftheir terminations by solder dip, soldering iron, solder wave, orreflow soldering techniques.
Object
The heat and/or environment of soldering may affect theelectrical characteristics of the connector and may cause damage tothe materials making up the connector. It may also result inloosening of terminations, softening or distortion of insulationmaterials, opening of solder seals, weakening of mechanical joints,etc.
- Edition:
- D
- Published:
- 02/28/2008
- ANSI:
- ANSI Approved
- Number of Pages:
- 20
- File Size:
- 0 files
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