This procedure establishes the test procedures for determiningtemperature rise versus current for connectors and sockets withconductor sizes equal to or less than 0000 AWG or equivalent.
Test methods
Method 1, specified current
The object of this test is to determine the temperature rise ofconnectors/sockets carrying a specified current; see 4.2.
Method 2, temperature rise versus currentcurve
The object of this test is to establish a characteristictemperature rise versus current curve for the connector or socket:see 4.3. This curve may subsequently be used to create a deratingcurve as appropriate for the stated maximum operating temperatureof the connector or socket.
Method 3, specified temperature rise
The object of this test is to determine the current level, thatwill not exceed a specified temperature rise; see 4.3.
Method 4, inaccessible contacts (TBD)
The object of this test is to determine the temperature riseand/or current derating curve when a group of signal contacts areenergized in connectors or sockets with multiple rows (3 or more)and where size and access to the contacts is not practical; see4.5.
- Edition:
- B
- Published:
- 06/01/2007
- ANSI:
- ANSI Approved
- Number of Pages:
- 24
- File Size:
- 0 files
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