This document covers requirements and test methods for anisotropically conductive adhesive films used to bond and electrically connect components and for their long-term properties as a part of the printed wiring board assembly. Applications include the following: flexible PWB-to-glass, flexible PWB-to-rigid PWB, flip chip-to-glass, flip chip-to-flexible PWB, flip chip-to-rigid PWB, and fine pitch SMD. The adhesive film may be supplied pre-attached to a flexible circuit or other product.
- Published:
- 11/01/1996
- Number of Pages:
- 32
- File Size:
- 1 file , 480 KB
- Product Code(s):
- 3408(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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