Surface mount pad cratering typically initiates prior to detection by existing electrical monitoring test methods. There are limited instrumentation techniques that are currently available that can identify non-electrical damage and its location to a high degree of accuracy. This guideline document establishes an acoustic emission (AE) method to evaluate the performance and reliability of surface mount attachments of electronics assemblies during mechanical loading.
- Published:
- 11/01/2013
- Number of Pages:
- 19
- File Size:
- 1 file , 1.3 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
Reviews
There are no reviews yet.