Contains industry-recommended test methods, defect definitions and illustrations for suppliers and users to assess the solderability of printed board surface conductors, lands and plated through-holes. Test methods covered include edge dip, rotary dip, solder float, wave solder and wetting balance.
- Published:
- 04/01/1992
- Number of Pages:
- 15
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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