This standard prescribes test methods, defect definitions, acceptance criteria, and illustrations for assessing the solderability of electronic component leads, terminations, solid wires, stranded wires, lugs and tabs. A test method for the resistance to dissolution/dewetting of metallization is also included in the standard. Intended for use by both vendors and users, J-STD-002D was developed by EIA, IPC and JEDEC.
- Published:
- 06/01/2013
- Number of Pages:
- 64
- File Size:
- 1 file , 2 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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