This procedure covers ESD stressing of packaged optoelectroniccomponents only and is not applicable to purely electroniccomponents. For purposes of this document a packaged optoelectroniccomponent includes assembled packages which contain on or moreoptoelectronic chips one or all of whose chip terminals aredirectly connected to the package terminals. For semiconductorlasers this package will, in most cases, include a rear facetmonitor and may include some monitoring circuitry.
This document applies to the ESD testing of any modulecircuitry, including the rear facet monitor as well as the laserchip, since such circuitry is an integral part of the laserpackage. This document applies to all multi-frequency and singlyfrequency laser devices that utilize semiconductor technology.Therefore, it includes, but is not limited to, Fabry-Perot lasers,distributed feedback (DFB) lasers, distributed Bragg reflector(DBR) lasers, and optoelectronic amplifiers and modulators. Thisdocument specifically excludes lasers which utilize only activeelements other than semiconductor devices (for example He-Ne, ArCO2 or Nd:YAG lasers.) The document also excludes packaged moduleswhich contain optoelectronic chips whose terminals are connectedonly to internal nodes. Such devices are more properly treated asHybrid ICs for the purpose of ESD testing.
Finally, it should be noted that this document covers only theapplication of Human Body Model (HBM) ESD testing. The applicationof other types of ESD such as the Charged Device Model (CDM) andthe Field induced Model (FIM) require different types of stressingapparatus and different procedures. In addition, these other ESDstressing models tend to produce different types of failuremechanisms in the components under test.
- Edition:
- 96
- Published:
- 07/01/1996
- Number of Pages:
- 27
- File Size:
- 1 file , 790 KB
Reviews
There are no reviews yet.