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JEDEC J-STD-033D

Original price was: $60.00.Current price is: $30.00.

The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe anddamage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.

Published:
04/02/2018
Number of Pages:
31
File Size:
1 file , 1.1 MB
Note:
This product is unavailable in Russia, Ukraine, Belarus

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JEDEC J-STD-033D
Original price was: $60.00.Current price is: $30.00.