The purpose of this document is to provide manufacturers and users with standardized methods for handling, packing, shipping, and use of moisture/reflow and process sensitive devices that have been classified to the levels defined in J-STD-020 or J-STD-075. These methods are provided to avoid damage from moisture absorption and exposure to solder reflow temperatures that can result in yield and reliability degradation. By using these procedures, safe anddamage-free reflow can be achieved. The dry-packing process defined herein provides a minimum shelf life of 12 months from the seal date.
- Published:
- 04/01/2018
- Number of Pages:
- 31
- File Size:
- 1 file , 1.1 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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