This standard facilitates the procurement and use of semiconductor die products provided in bare or bumped die form, and provides requirements and guidance to die suppliers as to the levels of as-delivered performance, quality and reliability expected. It also reflects the special needs of die product customers in terms of design and application data.
- Published:
- 10/01/2023
- Number of Pages:
- 20
- File Size:
- 1 file , 320 KB
- Note:
- This product is unavailable in Russia, Belarus
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