INACTIVE FOR NEW DESIGN
This standard provides a method for the packaging ofaxial/radial components, (diodes, transistors, resistors,capacitors, etc.) in blister packages, tubes, vials, and trays,etc.
- Edition:
- 3
- Published:
- 10/31/2012
- Number of Pages:
- 3
- File Size:
- 1 file , 590 KB
Reviews
There are no reviews yet.