This test method covers a procedure for comparativelydetermining the effects of printed conductor materials, conductorcross sections, substrate materials, and processes on thetemperature -D.C. current characteristics of printed wiring boards.A standard test sample is recommended and defined.
- Edition:
- A
- Published:
- 01/01/1970
- Number of Pages:
- 7
- File Size:
- 0 files
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