BACKGROUND AND PURPOSE
Leaded Electronic Component parts are subjected to a widevariety of internal stresses during the soldering of theirterminations by solder dips, soldering irons, or automatic wavesoldering techniques. The heat can either be conducted through themetal termination into the body of the component part, or absorbeddirectly or indirectly as radiant heat emanating from solder baths,waves or preheaters, or both. This document is intended as a guidefor users of leaded electronic component parts that exist today.Furthermore, recommendations are given on the cleaning, retinning,packaging and storage of these component parts. it is recognizedthat many components behave differently during installation andlead retinning operations. Hermetically sealed components must betreated differently from non-hermetic sealed types. Other soldercompositions than those recommended in this guide may be used.Solder irons of different mass and tip temperatures may be usedproviding the end result is not detrimental to the component. Thisdocument is intended as a guideline only and in many casesmanufacturers’ suggested procedures should be used.
- Edition:
- 89
- Published:
- 01/01/1989
- ANSI:
- ANSI Approved
- Number of Pages:
- 8
- File Size:
- 0 files
Reviews
There are no reviews yet.