W/D NO S/S
The Burn-In Sockets of assessed quality covered by this DetailSpecification shall have:
a) Maximum enclosure (maximum length, width, and heightdimensions).
b) A working voltage not exceeding _ volts (rms).
c) Current not exceeding _ ampere per pin.
OBJECT
The object of this Detail Specification is to provide allinformation required for the identification and quality assessmentof the Burn-In Sockets for Chip Carrier Packages with MoldedCarrier Rings. The sockets have solder tail leads. The informationcontained herein or by reference, is complete and sufficient forinspection purposes.
- Edition:
- 93
- Published:
- 01/01/1993
- Number of Pages:
- 19
- File Size:
- 0 files
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