ECIA CB-11

SCOPE AND INTRODUCTION

This document provides guidelines for the use of multilayerceramic chip capacitors, their design and construction as well ashandling, mounting .and connection requirements. Use of chipcapacitors to construct hybrid microcircuits is a mature technologyin widespread use. The use of capacitor chips on printed wiring orprinted circuit boards as well as other larger area substrates suchas ceramic or porcelainized-steel, is a comparatively newtechnology generally referred to as SMT, surface mounttechnology.

The physical and mechanical aspects of -the chip and its use arethe primary subjects of this document. Included is a review of thedesign and materials employed in the chip’s construction, as wellas the material and process requirements for their mounting andinterconnection by soldering.

Guidelines for the selection and use of these chips based onelectrical ratings, values and performance characteristics aregiven in ELA specification EIA-198-C, Ceramic DielectricCapacitors.

Note that this document concentrates and directs its informationto the mounting and interconnection of chips bysoldering.

PURPOSE

‘The information is provided to assist the user’s variousengineering and manufacturing personnel in the making of informedchoices in regard to these chip capacitors; their selection,specification and circuit assembly processing.

Edition:

86

Published:

01/01/1986

Number of Pages:

56

File Size:

0 files