STABILIZED: 01/2014 * ADDENDUM TO EIA CB 5
The scope of this supplement to EIA Components Bulletin No. 5 isto present methods of instrumentation for plastic casesemiconductors and integrated circuits for evaluation of thermaldissipating devices.
- Edition:
- 71
- Published:
- 05/01/1971
- Number of Pages:
- 14
- File Size:
- 0 files
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