STABILIZED: MARCH 2014
This specification covers interconnect systems typically usedfor production ball grid array (BGA) devices with pin counts of1089 and greater.
Purpose
The purpose of this detail specification is to provide allinformation required for the identification and assessment of theBGA socket described herein. The information, contained herein orby reference, is complete and sufficient for inspectionpurposes.
- Edition:
- A
- Published:
- 10/01/2001
- Number of Pages:
- 40
- File Size:
- 0 files
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