The Multi-Package Module Sockets of assessed quality covered bythis Detail Specification shall have:
a) Maximum enclosure dimensions (See Figure 1.)
b) Working voltage not to exceed 250 volt (rms).
c) Current not to exceed 1.0 ampere per pin.
OBJECT
The object of this Detail Specification is to provide allinformation required using Sectional Specification EIA-540F000 as abase, for the identification and quality assessment of Multi-Package Module Sockets for the NECQ quality system. The informationcontained herein or by reference is complete and sufficient forinspection purposes.
- Edition:
- 92
- Published:
- 06/01/1992
- Number of Pages:
- 24
- File Size:
- 0 files
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