This standard establishes a test method for determining whether connectors can withstand the effects of the heating and/or environment that they will be subjected to during the soldering of their terminations by solder dip, soldering iron, solder wave, or reflow soldering techniques.
- Edition:
- C
- Published:
- 08/01/2006
- ANSI:
- ANSI Approved
- Number of Pages:
- 20
- File Size:
- 0 files
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