Description
This specification defines the qualification program forIntegrated Passive Devices (IPD) with die level solder bumpinterconnects. The qualification program is defined in Table 1.Specification sheets can be added, as required, to define specificproducts or to cover unique/specific requirements. This documentdoes not relieve the supplier of its responsibility to its owncompany’s internal qualification and on-going certificationprogram.
Preconditioning
This process is intended to simulate exposure to the thermalenvironment of the typical printed circuit board assembly processbefore any specific qualification testing is conducted. Therecommended reflow process simulation for bonding IPD’s with dielevel solder bump interconnects in the industry is described inappendix A.
- Edition:
- 05
- Published:
- 11/01/2005
- Number of Pages:
- 20
- File Size:
- 0 files
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