Soldering of SMT components is performed, in general, at arelatively low soldering temperature (215°C). Thus, the reflowcharacteristics of the finish must be carefully considered. Inaddition, the solder joint itself is less forgiving to marginalconditions which may exist relative to solder joint strength,fillet size, pad/lead size ratios, etc. Thus finish compatibilityis of prime importance. This document is a guide in establishingfinishes for SMT terminations.
- Edition:
- 87
- Published:
- 07/01/1987
- Number of Pages:
- 10
- File Size:
- 0 files
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