There are two basic processes for soldering surface mountconnectors — vapor phase and infra-red. Both apply heat which thetotal connector systems is exposed to with no insulating medium(e.g. printed circuit boards) between the termination and connectorassembly. In addition to heat, the vapor phase system employs achemical medium (perfluoro-carbon) in a vapor form. Connectormaterials are exposed to these mediums and thus must withstand bothheat and chemical vapors. There are three basic features which mustbe evaluated prior to a material or connector configuration beingacceptable for surface mount process. These factors are:
A: Heat Impact
B: Dimensional Stability
C: Chemical Resistance
This procedure establishes a technique to evaluate plasticmaterials used for connector housings which will be exposed to avapor phase reflow process.
- Edition:
- 87
- Published:
- 07/01/1987
- Number of Pages:
- 5
- File Size:
- 0 files
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