SAME AS ANSI C83.93 * ALSO SEE EIA-186 SERIES
This standard defines a test for solderability of solid leadwires, terminals, and conductive accessories of component partswhich are to be joined by a soldering operation involving the useof rosin type flux and solder of the types of covered by QQ-S-571.The specific times and temperatures are for lead wires notgreater than 0.045 inch (1.14 mm) in diameter. For larger diameterwires, stranded leads or other parts, the test procedure may bemodified as outlined in Paragraph 10. This standard includes testconditions which may be selected and referenced as condition 1, or2 as per Paragraph 7.
PURPOSE
The purpose of this test standard is to determine thesolderability of solid lead wires, terminals, and otherterminations which are normally joined by means of soft solder.
This Standard shall not be construed as a production procedurefor soldering operations.
The solderability determination is made on the bask of theability of the terminal of the part to be wetted by a coat of newsolder, to verify that the treatment used in the manufacturingprocess to facilitate soldering is satisfactory, and that thistreatment has been applied to the required portion of the partdesigned to accommodate a soldered connection.
The applicability of this test standard as to the size of theterminals tested should he considered before use in the referencingspecification. The solder temperatures and the dwell times given inthis standard are normally limited to component parts withterminals up to 17AWG wire size or 0.045 inch (1.14mm) in diameter.Variation in pot temperature, Paragraph 7, and the immersionprocedure, Paragraph 8.2, of the standard will provide forspecifications that include larger type terminals.
- Edition:
- E
- Published:
- 10/01/1978
- ANSI:
- ANSI Approved
- Number of Pages:
- 9
- File Size:
- 0 files
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