ETSI GS SMT 001 proposes mechanical and electrical requirements for wireless module implementations. Thisincludes the SMT pad layout and common interface assignments for essential pads including some general electricalcharacteristics. Certain aspects such as z-height, shielding geometry and weight are not defined by the presentdocument.
The SMT module pad configurations defined in the present document are primarily intended to allocate specific padfunctionalities that need to be routed on the host device to the respective pads on the SMT module. Although manyinterfaces may be defined in the various pad configurations, it does not necessarily imply that all interfaces need to besupported at the same time. The assigned allocations are intended to enable the module supplier and host deviceintegrator to design compatible circuits with aligned pad assignments as specified.
- Edition:
- 2.1.1
- Published:
- 06/01/2015
- Number of Pages:
- 69
- File Size:
- 1 file , 1.3 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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