The present document is an aid for all integrators of Information and Communication Technologies (ICT) equipment to minimize thermal problems. It establishes recommendations for the thermal management of racks/cabinets, miscellaneous racks/cabinets and locations.
The present document considers telecommunication Central Office (CO) and Data Centers (DC) locations.
The present document considers only the thermal factors. The integrator should consider the thermal factors in conjunction with the ETSI EN 300 019-1-3 [i.1] and other non-thermal factors.
- Edition:
- 1.4.1
- Published:
- 10/01/2015
- Number of Pages:
- 45
- File Size:
- 1 file , 1.8 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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