Establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies tosingle, double or multi-layered boards.Key concepts in this document are: rigid laminate properties, designer/end user materials section map, and scoring parameters.This document should be used in conjunction with IPC- 2221.
- Published:
- 03/01/1998
- Number of Pages:
- 24
- File Size:
- 1 file , 900 KB
- Product Code(s):
- 2222(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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