This guideline addresses the major factors influencing the design of high-speed circuitry. Considerations include electrical noise, electromagnetic interference, signal propagation time, impedance, thermo-mechanical environmental protection, and heat dissipation. Supersedes IPC-D-317A. Key improvements over the IPC-D-317A document include updated impedance models for embedded microstrip, centered stripline and dual stripline geometries, expanded EMI layout practices, signal integrity design constraints, enhanced graphics and updated terms and definitions.
- Published:
- 11/01/2003
- Number of Pages:
- 99
- File Size:
- 1 file , 1 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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