This specification covers end product inspection and test of high frequency (microwave) printed boards for microstrip, stripline, mixed dielectric and multilayer stripline applications with or without buried/blind vias, and metal cores.
The printed board may contain embedded active or passive circuitry with distributive capacitive planes, capacitive or resistive components conforming to IPC-6017. The printed board may contain build up High Density Interconnect (HDI) layers.
- Published:
- 02/01/2022
- ISBN(s):
- 9781638160601
- Number of Pages:
- 60
- File Size:
- 1 file , 2.7 MB
- Product Code(s):
- 6018-STD-0-D-0-EN-D
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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