This new document provides guides for the design and fabrication of stencils for solder paste andsurface-mount adhesive.This is the first time this important information has been collected andpublished in an industry consensus document.Stencil design for various surface-mounttechnology, as well as mixed technology with through-hole or flip chip components is discussed;this includes overprint, two-print and step stencil designs.A sample order form and a userinspection checklist are also included.
- Published:
- 05/01/2000
- Number of Pages:
- 20
- File Size:
- 1 file , 330 KB
- Product Code(s):
- 7525(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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