Now includes support for stencils used with lead free processes.
This document provides guidelines for the design and fabrication of stencils for solder paste and surface-mount adhesive. Stencil design for various surface-mount technology, as well as mixed technology with through-hole or flip chip components is discussed. This includes differences for tin lead and lead free solder paste, overprint, two-print and step stencil designs. A sample order form and user inspection checklist are also included.
- Published:
- 02/01/2007
- Number of Pages:
- 28
- File Size:
- 1 file , 800 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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