This document provides guidelines for the design and fabrication of stencils for solder paste and surface mount adhesive with discussion on through-hole and mixed technology. This includes differences for tin lead and lead-free solder paste, overprint, two-print and step stencil designs.
- Published:
- 10/01/2011
- Number of Pages:
- 36
- File Size:
- 1 file , 2.1 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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