During mass soldering, it is important that all solder joints reach the minimum soldering (reflow) temperature to assure metallurgical bonding of thesolder alloy and the base metals to be soldered. Metallurgical bonding requires that both surfaces to be soldered, as well as the solder, reach thisminimum soldering temperature for a sufficient time to allow the wetting of the solder surfaces. This document provides guidelines for theconstruction of appropriate profiling test vechicles and various techniques and methodologies for temperature profiling.
- Published:
- 06/01/2001
- Number of Pages:
- 24
- File Size:
- 1 file , 120 KB
- Product Code(s):
- 7530(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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