This document is another in a series and specifically addresses preconditioning of non-IC components used in electronic assembly. Do the components work with your process? That determination is the goal of these manufacturing process simulations; to ensure that the components chosen meet expected reliability requirements after exposure to factory processes. Developed for users and manufacturers, the procedure consists of a set of simulations, for non-IC component storage and use, wave and reflow soldering (SMT and PTH parts), exposure to corrosive (water soluble) fluxes, and exposure to often-used cleaning materials.
- Published:
- 06/01/1998
- ANSI:
- ANSI Approved
- Number of Pages:
- 27
- File Size:
- 1 file , 200 KB
- Part of:
- IPC M109, IPC 9500-K
- Product Code(s):
- 9504(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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