This specification establishes a thermal cycling test method to characterize the fatigue lifetimes of surface mount solder attachments of electronic assemblies. The surface mount devices may be solder-attached to rigid, flexible or rigid-flex printed boards. The characterization results can be used to predict field lifetime of solder attachments for the use environments and conditions of electronic assemblies.
- Published:
- 02/01/2022
- ISBN(s):
- 9781638160724
- Number of Pages:
- 24
- File Size:
- 1 file , 1 MB
- Product Code(s):
- 9701-STD-0-D-0-EN-B, 9701-STD-0-D-0-EN-B
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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