THis standard establishes mechanical outline requirements for devices supplied in flip chip or CHip Size Package (CSP) formats. including die surface, die terminals, and interconnection balls/bumps/lands to the next level.
- Published:
- 02/01/2003
- Number of Pages:
- 20
- File Size:
- 1 file , 90 KB
- Product Code(s):
- J-027(D)1, J-027(D)1
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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