The purpose of this standard is to identify the classification level of non-hermetic SMDs that are sensitive to moisture-induced stress so that they can be properly packaged, stored, and handled to avoid damage during assembly solder reflow attachment and/or repair operations.
- Published:
- 12/01/2022
- Number of Pages:
- 30
- File Size:
- 1 file , 610 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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