This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.
- Published:
- 11/01/2022
- Number of Pages:
- 48
- File Size:
- 1 file , 2.2 MB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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