This Test Method establishes a uniform method for performing component package power cycling stress test. This specification covers power induced temperature cycling of a packaged component, simulating the non-uniform temperature distribution resulting from a device powering on and off in the application.
- Published:
- 08/01/2007
- Number of Pages:
- 17
- File Size:
- 1 file , 140 KB
- Note:
- This product is unavailable in Russia, Ukraine, Belarus
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