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JEDEC JESD59

Original price was: $62.00.Current price is: $31.00.

This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.

Published:
06/01/1997
Number of Pages:
16
File Size:
1 file , 260 KB
Note:
This product is unavailable in Russia, Ukraine, Belarus

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JEDEC JESD59
Original price was: $62.00.Current price is: $31.00.