This procedure covers ESD stressing of packaged optoelectroniccomponents only and is not applicable to purely electroniccomponents. For purposes of this document a packaged optoelectroniccomponents includes assembled packages which contain one or moreoptoelectronic chips one or all of whose chip terminals aredirectly connected to the package terminals. For semiconductorlasers this package will, in most cases, include a rear facetmonitor and may include some monitoring circuitry.
This document applies t the ESD testing of any module circuitry,including the rear facet monitor as well as the laser chip, sincesuch circuitry is an integral part of the laser package. Thisdocument applies to all multi-frequency and single frequency laserdevices that utilize semiconductor technology. Therefore, itincludes, but is not limited to, Fabry-Perot lasers, distributedfeedback (DFB) lasers, distributed Bragg reflector (DBR) lasers,and optoelectronic amplifiers and modulators. This documentspecifically exludes lasers which utilize only active elementsother than semiconductor devices (for example, He-Ne, Ar, CO2, orNd: YAG lasers) The document also excludes packaged modules whichcontain optoelectronic chips whose terminals are connected only tointernal nodes. Such devices are more properly treated as HybridICs for the purpose of ESD testing.
Finally, it should be noted that this document covers only theapplication of Human Body Model (HBM) ESD testing. The applicationof other types of ESD such as the Charged Device Model (CDM) andthe Field Induced Model (FIM) require different types of stressingapparatus and different procedures. In Addition, these other ESDstressing models tend to produce different types of failuremechanisms in the components under test.
- Edition:
- 96
- Published:
- 07/01/1996
- Number of Pages:
- 28
- File Size:
- 1 file , 830 KB
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